2N7002KT1G onsemi MOSFET N-CH 60V 320MA SOT-23

label:
29/05/2026 153
2N7002KT1G onsemi  MOSFET N-CH 60V 320MA SOT-23


• ESD Protected
• Low RDS(on)
• Surface Mount Package
• 2V Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant


CATALOG
2N7002KT1G COUNTRY OF ORIGIN
2N7002KT1G PARAMETRIC INFO
2N7002KT1G PACKAGE INFO
2N7002KT1G MANUFACTURING INFO
2N7002KT1G PACKAGING INFO
2N7002KT1G ECAD MODELS
2N7002KT1G APPLICATIONS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain-Source Voltage (V) 60
Maximum Continuous Drain Current (A) 0.38
Maximum Absolute Continuous Drain Current (A) 0.38
Maximum Gate-Source Voltage (V) ±20
Maximum Drain-Source Resistance (mOhm) 1600@10V
Typical Gate Charge @ Vgs (nC) 0.7@4.5V
ID For GFS (A) 0.2
VDS For GFS (V) 5
Maximum Input Capacitance @ Vds (pF) 45@20V
Breakdown Voltage Type DSS
Typical Gate Charge @ 10V (nC) 0.7
Operating Junction Temperature (°C) -55 to 150
Maximum Power Dissipation (mW) 420
Minimum Gate Threshold Voltage (V) 1
Category Small Signal
Typical Gate to Drain Charge (nC) 0.1
Typical Output Capacitance (pF) 4.2
Typical Gate to Source Charge (nC) 0.3
Maximum Junction Ambient Thermal Resistance (°C/W) 417
Maximum Positive Gate-Source Voltage (V) 20
Typical Input Capacitance @ Vds (pF) 24.5@20V
Typical Reverse Transfer Capacitance @ Vds (pF) 2.2@20V
Typical Diode Forward Voltage (V) 0.8
Maximum Diode Forward Voltage (V) 1.2
Typical Forward Transconductance (S) 0.53
Maximum Pulsed Drain Current @ TC=25°C (A) 5
Typical Turn-On Delay Time (ns) 12.2
Typical Turn-Off Delay Time (ns) 55.8
Typical Fall Time (ns) 29
Typical Rise Time (ns) 9
Maximum Gate-Source Leakage Current (nA) 10000
Maximum Gate Threshold Voltage (V) 2.3
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Tradename PowerTrench®
 

PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 0.94
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Terminal Width (mm) 0.44
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_L (mm) 3.04
Minimum PACKAGE_DIMENSION_L (mm) 2.8
Maximum PACKAGE_DIMENSION_W (mm) 1.4
Minimum PACKAGE_DIMENSION_W (mm) 1.2
Maximum Diameter (mm) N/R
Minimum Diameter (mm) N/R
Minimum Seated_Plane_Height (mm) 0.89
Minimum PACKAGE_DIMENSION_H (mm) 0.88
Maximum PACKAGE_DIMENSION_H (mm) 1.01
Maximum Seated_Plane_Height (mm) 1.11
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeNi
Number of Wave Cycles N/R
 

PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Packaging Document Link to Datasheet
 
ECAD MODELS



APPLICATIONS
• Low Side Load Switch
• Level Shift Circuits
• DC−DC Converter
• Portable Applications i.e. DSC, PDA, Cell Phone, etc.

Prodotto RFQ