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• Lowest height (2.4 mm) in this package footprint
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| • Shielded construction |
| • Frequency range up to 5.0 MHz |
• Handles high transient current spikes without saturation
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• Ultra low buzz noise, due to composite construction
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| CATALOG |
IHLP2525BDERR22M01 COUNTRY OF ORIGIN
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IHLP2525BDERR22M01 PARAMETRIC INFO
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IHLP2525BDERR22M01 PACKAGE INFO
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IHLP2525BDERR22M01 MANUFACTURING INFO
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IHLP2525BDERR22M01 PACKAGING INFO
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IHLP2525BDERR22M01 ECAD MODELS
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IHLP2525BDERR22M01 APPLICATIONS
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COUNTRY OF ORIGIN
|
| China |
|
PARAMETRIC INFO
|
| Type |
Power Choke |
| Technology |
Wirewound |
| Protection Style |
Shielded |
| Core Material |
Powdered Iron |
| Inductance (H) |
0.22u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
100K |
| Maximum DC Current (A) |
21(Typ) |
| Maximum Saturation Current (A) |
34(Typ) |
| Maximum DC Resistance (Ohm) |
0.0032 |
| Inductance Decrease Percentage @ Isat (%) |
20 |
| Operating Temperature (°C) |
-55 to 125 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
|
|
PACKAGE INFO
|
| Case Size |
2525 |
| Maximum Product Length (mm) |
7.24 |
| Maximum Product Depth (mm) |
6.72 |
| Maximum Product Height (mm) |
2.4 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.62 |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Product Diameter (mm) |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
20 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
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PACKAGING INFO
|
| Packaging Suffix |
ER |
| Packaging |
Tape and Reel |
|
|
ECAD MODELS
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| APPLICATIONS |
• PDA / notebook / desktop / server applications
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• High current POL converters
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| • Low profile, high current power supplies |
| • Battery powered devices |
| • DC/DC converters in distributed power systems |
|