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■ LM50-Q1 is AEC-Q100 Grade 1 Qualified and is
Manufactured on an Automotive Grade Flow
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■ Calibrated Directly in Degrees Celsius
(Centigrade)
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■ Linear + 10 mV/°C Scale Factor
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■ ±2°C Accuracy Specified at 25°C
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■ Specified for Full –40° to 125°C Range
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■ Suitable for Remote Applications
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■ Low Cost Due to Wafer-Level Trimming
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■ Operates From 4.5 V to 10 V
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■ Less Than 130-µA Current Drain
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■ Low Self-Heating: Less Than 0.2°C in Still A
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■ Nonlinearity Less Than 0.8°C Over Temp
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■ UL Recognized Component
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| CATALOG |
| LM50QIM3/NOPB COUNTRY OF ORIGIN |
LM50QIM3/NOPB PARAMETRIC INFO
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LM50QIM3/NOPB PACKAGE INFO
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LM50QIM3/NOPB MANUFACTURING INFO
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| LM50QIM3/NOPB PACKAGING INFO
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LM50QIM3/NOPB ECAD MODELS
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LM50QIM3/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
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| Malaysia |
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PARAMETRIC INFO
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| Function |
Temp Sensor |
| Sensor Gain |
10.3mV/°C(Max) |
| Output Type |
Analog |
| Module/IC Classification |
IC |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5|9 |
| Operating Temperature (°C) |
-40 to 125 |
| Operating Range |
-40°C to 125°C |
| Response Point List |
(-25,0.25),(100,1.5) |
| Minimum Temperature Sensing (°C) |
-40 |
| Maximum Operating Supply Voltage (V) |
10 |
| Maximum Temperature Sensing (°C) |
125 |
| Maximum Output Voltage (V) |
0.6 |
| Minimum Output Voltage (V) |
-1 |
| Topology |
v(1,1) |
| Maximum Supply Current (uA) |
130 |
| Accuracy |
±4°C(Max) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Operating Supply Voltage (V) |
4.5 to 10 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.04(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Seated Plane Height (mm) |
1.12(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Automotive
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• Computers
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• Disk Drives
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| • Battery Management |
• FAX Machines
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• Printers
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• Portable Medical Instruments
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• HVAC
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• Power Supply Modules
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