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| CATALOG |
LQP15MN1N1W02D COUNTRY OF ORIGIN
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LQP15MN1N1W02D PARAMETRIC INFO
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LQP15MN1N1W02D PACKAGE INFO
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LQP15MN1N1W02D MANUFACTURING INFO
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LQP15MN1N1W02D PACKAGING INFO
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COUNTRY OF ORIGIN
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| Japan |
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PARAMETRIC INFO
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| Type |
RF Chip |
| Technology |
Thick Film |
| Protection Style |
Unshielded |
| Inductance (H) |
0.0011u |
| Tolerance |
0.05nH |
| Inductance Test Frequency (Hz) |
500M |
| Maximum DC Current (A) |
0.39 |
| Maximum DC Resistance (Ohm) |
0.1 |
| Minimum Quality Factor |
13 |
| Quality Test Frequency (Hz) |
500M |
| Minimum Self Resonant Frequency (Hz) |
6000M |
| Operating Temperature (°C) |
-40 to 85 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
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PACKAGE INFO
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| Case Size |
0402 |
| Maximum Product Length (mm) |
1.1 |
| Maximum Product Depth (mm) |
0.6 |
| Maximum Product Height (mm) |
0.45 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.0006 |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Product Diameter (mm) |
N/R |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging Suffix |
D |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
10000 |
| Reel Diameter (in) |
7.09 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Paper |
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