MC9S08LL16CLH NXP Semiconductors IC MCU 8BIT 16KB FLASH 64LQFP

label:

20/10/2023 162

• 8-Bit HCS08 Central Processor Unit (CPU)
– Up to 20-MHz CPU at 3.6V to 1.8V across temperature range of -40°C to 85°C
– HC08 instruction set with added BGND instruction
– Support for up to 32 interrupt/reset sources

• On-Chip Memory
– Dual Array FLASH read/program/erase over full operating voltage and temperature
– Random-access memory (RAM)
– Security circuitry to prevent unauthorized access to RAM and FLASH contents

• Power-Saving Modes
– Two low power stop modes
– Reduced power wait mode
– Low power run and wait modes allow peripherals to run while voltage regulator is in standby
– Peripheral clock gating register can disable clocks to unused modules, thereby reducing currents.
– Very low power external oscillator that can be used in stop2 or stop3 modes to provide accurate clock source to real time counter
– 6 usec typical wake up time from stop3 mode

• Clock Source Options
– Oscillator (XOSC) — Loop-control Pierce oscillator; Crystal or ceramic resonator range of 31.25 kHz to 38.4 kHz or 1 MHz to 16 MHz
– Internal Clock Source (ICS) — Internal clock source module containing a frequency-locked-loop (FLL) controlled by internal or external reference; precision trimming of internal reference allows 0.2% resolution and 2% deviation over temperature and voltage; supports bus frequencies from 1MHz to 10 MHz.

• System Protection
– Watchdog computer operating properly (COP) reset with option to run from dedicated 1-kHz internal clock source or bus clock
– Low-Voltage Warning with interrupt
– Low-Voltage Detection with reset or interrupt
– Illegal opcode and illegal address detection with reset
– Flash block protection

• Development Support
– Single-wire background debug interface
– Breakpoint capability to allow single breakpoint setting during in-circuit debugging (plus two more breakpoints in on-chip debug module)
– On-chip in-circuit emulator (ICE) debug module containing three comparators and nine trigger modes. Eight deep FIFO for storing change-of-flow addresses and event-only data. Debug module supports both tag and force breakpoints

• Peripherals
– LCD — 4x28 or 8x24 LCD driver with internal charge pump and option to provide an internally regulated LCD reference that can be trimmed for contrast control.
– ADC — 8-channel, 12-bit resolution; 2.5 μs conversion time; automatic compare function; temperature sensor; internal bandgap reference channel; operation in stop3; fully functional from 3.6V to 1.8V
– ACMP — Analog comparator with selectable interrupt on rising, falling, or either edge of comparator output; compare option to fixed internal bandgap reference voltage; outputs can be optionally routed to TPM module; operation in stop3
– SCI — Full duplex non-return to zero (NRZ); LIN master extended break generation; LIN slave extended break detection; wake up on active edge
– SPI— Full-duplex or single-wire bidirectional; Double-buffered transmit and receive; Master or Slave mode; MSB-first or LSB-first shifting
– IIC — IIC with up to 100 kbps with maximum bus loading; Multi-master operation; Programmable slave address; Interrupt driven byte-by-byte data transfer; supports broadcast mode and 10-bit addressing
– TPMx — Two 2-channel (TPM1 and TPM2); Selectable input capture, output compare, or buffered edge- or center-aligned PWM on each channel;
– TOD— (Time Of Day) 8-bit quarter second counter with match register; External clock source for precise time base, time-of-day, calendar or task scheduling functions; Free running on-chip low power oscillator (1 kHz) for cyclic wake-up without external components.

• Input/Output
– 38 GPIOs, 2 output-only pins
– 8 KBI interrupts with selectable polarity
– Hysteresis and configurable pull up device on all input pins; Configurable slew rate and drive strength on all output pins.

• Package Options
– 64-LQFP, 48-LQFP and 48-QFN

CATALOG

MC9S08LL16CLH COUNTRY OF ORIGIN

MC9S08LL16CLH PARAMETRIC INFO

MC9S08LL16CLH PACKAGE INFO

MC9S08LL16CLH MANUFACTURING INFO

MC9S08LL16CLH PACKAGING INFO

MC9S08LL16CLH ECAD MODELS

COUNTRY OF ORIGIN

China

PARAMETRIC INFO

Data Bus Width (bit)	8
Family Name	S08
Device Core	S08
Instruction Set Architecture	CISC
Maximum Clock Rate (MHz)	20
Program Memory Type	Flash
Program Memory Size	16KB
RAM Size	2KB
Direct Memory Access	No
Floating Point Unit	No
Bluetooth	No
Wi-Fi	No
Multiply Accumulate	No
Touch Sensing Interface	No
Power On Reset	No
Memory Protection Unit	No
Temperature Sensor	Yes
DDR	No
Memory Management Unit	No
Integrated Development Environment	No
Super Scalar	No
External Bus Interface	No
Maximum CPU Frequency (MHz)	20
Number of Programmable I/Os	38
Number of Timers	1
ADC Channels	8
ADC Resolution (bit)	12
Core Architecture	S08
Number of ADCs	Single
LCD Segments	112\|192
Analog Comparators	3
Parallel Master Port	No
Real Time Clock	No
Special Features	LCD Controller
Interface Type	I2C/SCI/SPI
Programmability	Yes
SPI	1
I2C	1
I2S	0
UART	0
USART	0
CAN	0
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	1.8
Typical Operating Supply Voltage (V)	2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Operating Supply Voltage (V)	2.5\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	64
Lead Shape	Gull-wing
PCB	64
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	10
Package Width (mm)	10
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	12
Package Overall Width (mm)	12
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	0.34655
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BCD
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging	Tray
Quantity Of Packaging	800
Packaging Document	Link to Datasheet

ECAD MODELS