|
|
• Inputs are TTL-voltage compatible |
• Latch-up performance exceeds 250 mA per JESD
17 |
• ESD protection exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101) |
• On products compliant to MIL-PRF-38535,
all parameters are tested unless otherwise noted.
On all other products, production processing does
not necessarily include testing of all parameters. |
|
CATALOG |
SN74AHCT14PWR COUNTRY OF ORIGIN |
SN74AHCT14PWR PARAMETRIC INFO |
SN74AHCT14PWR PACKAGE INFO |
SN74AHCT14PWR MANUFACTURING INFO |
SN74AHCT14PWR PACKAGING INFO |
SN74AHCT14PWR ECAD MODELS |
SN74AHCT14PWR FUNCTIONAL BLOCK DIAGRAM |
SN74AHCT14PWR APPLICATIONS
|
|
COUNTRY OF ORIGIN |
Japan |
Malaysia |
Philippines |
|
PARAMETRIC INFO |
Logic Family |
AHCT |
Process Technology |
CMOS |
Logic Function |
Inverter Schmitt Trigger |
Input Type |
Schmitt Trigger |
Output Type |
Push-Pull |
Number of Elements per Chip |
6 |
Minimum Operating Supply Voltage (V) |
4.5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Typical Operating Supply Voltage (V) |
5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Commercial |
Maximum Propagation Delay Time @ Maximum CL (ns) |
8@5V |
Absolute Propagation Delay Time (ns) |
9 |
Propagation Delay Test Condition (pF) |
50 |
Maximum High Level Output Current (mA) |
-8 |
Maximum Low Level Output Current (mA) |
8 |
Maximum Quiescent Current (uA) |
2 |
|
PACKAGE INFO |
Supplier Package |
TSSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
14 |
Lead Shape |
Gull-wing |
PCB |
14 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
5.1(Max) |
Package Width (mm) |
4.5(Max) |
Package Height (mm) |
1.05(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5.1(Max) |
Package Overall Width (mm) |
6.6(Max) |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Shrink Small Outline Package |
Package Family Name |
SOP |
Jedec |
MO-153AB-1 |
Package Outline |
Link to Datasheet |
|
MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
|
PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
|
ECAD MODELS |
|
|
FUNCTIONAL BLOCK DIAGRAM |
|
|
APPLICATIONS |
• Servers |
• Network switches |
• Telecom infrastructures |
• Tests and measurements |
|